ITG Expert Group KT 3.2
Workshop: Photonic Integrated Circuits – from Platform to Packaging
Tuesday, April 9 2024 10:00 – 17:00, Berlin
Integrated photonic circuits are becoming a major innovation core in various application areas ranging from classic telecom and datacom to optical wireless, Terahertz, LIDAR/ RADAR, life science and medicine. Over the past 20 years extensive efforts have been dedicated to establish the analog of electronic IC platform technologies in the photonic domain. Today, PIC technologies are accessible at low cost in a variety of material systems on the German and European market. These technology platforms provide a large degree of convenience for potential PIC users, including process design kits, design automation tools, and multi-user logistics. Despite a much-reduced threshold in the area of PIC manufacturing, the question for users remains how to tackle a PIC based development, in particular with respect to packaging.
The ITG-Workshop will address this multi-faceted problem space by gathering experts of the entire spectrum of PIC manufacture and packaging providing their respective perspectives on the PIC application arena. Ample opportunity will be given to discuss possibilities as well as challenges for potential users of the PIC ecosystem.
Registration
Fee: 99,-€ (incl. VAT)
Organising Committee
Anna Lena Schall-Giesecke (Fraunhofer IMS)
Ulrich Fischer (Hochschule Harz)
Krzysztof Nieweglowski (TU Dresden)
Lars Zimmermann (TU Berlin)
Tolga Tekin (Fraunhofer IZM)
Location
Fraunhofer IZM Berlin
Gustav-Meyer-Allee 25, 13355 Berlin
Geb. 17, Raum 17.060x
PROGRAMME
| 9:30 – 10:00 Registration | |
| 10:00 – 11:20 | Session 1: Platforms |
| 10:00 | Michael Töpper, FMD Research Fab Microelectronics Germany (FMD): Expanding to an European Advanced Heterogeneous System Integration Pilot Line |
| 10:20 | Axel Schönau, Fraunhofer HHI Foundry and Packaging Services for InP Photonic Integrated Circuits |
| 10:40 | Georg Winzer, IHP The photonic BiCMOS platform of IHP |
| 11:00 | Aleksandar Nesic, Fraunhofer IMS Post-CMOS Photonics Platform |
| 11:20 – 11:50 Coffee break | |
| 11:50 – 13:10 | Session 2: Platforms and System Integration |
| 11:50 | Joni Mellin, X-Fab X-FAB “More than Photonics” – Enabling photonics innovation beyond PICs |
| 12:10 | Hermann Oppermann, Fraunhofer IZM Photonics Hybrid Integration Challenge |
| 12:30 | Krzysztof Nieweglowski, TU Dresden Multi-lithography process development for polymeric optics integration in electronic systems |
| 12:50 | Simon Kibben, Photonics Foundry Photonics packaging automation: Turning ideas into concepts and products |
| 13:10 – 14:00 Lunch break | |
| 14:00 – 15:20 | Session 3: Assembly and Packaging |
| 14:00 | Gerrit Rössler, Berlin Partner für Wirtschaft und Technologie GmbH Photonics and microelectronics in Berlin-Brandenburgs economic policy – support schemes and funding opportunities |
| 14:20 | Gianni Preve, Electron-mec An investigation on automation for silicon photonics packaging |
| 14:40 | Andon Bano, ficonTEC Technology Developments & Equipment Requirements for Scaling Up Photonics Production |
| 15:00 | Milan Milosevic, PHIX Industrial Photonics Packaging – From Prototypes to Volume Production |
| 15:20 – 15:50 Coffee break | |
| 15:50 – 17:10 | Session 4: Use Cases |
| 15:50 | Benjamin Wohlfeil, Adtran Photonic Integrated Circuits for Optical Communication Networks |
| 16:10 | Torsten Grawunder, Swissbit AG Could silicon photonics democratize the heterogeneous integration of chiplets? |
| 16:30 | Bogdan Sirbu, Fraunhofer IZM Faster, higher, stronger: Co-packaged optics |
| 16:50 | Antonio Napoli, Infinera Photonic Integrated Circuits for High-Speed Communications |