ITG Expert Group KT 3.2

Workshop: Photonic Integrated Circuits – from Platform to Packaging

Tuesday, April 9 2024 10:00 – 17:00, Berlin

Integrated photonic circuits are becoming a major innovation core in various application areas ranging from classic telecom and datacom to optical wireless, Terahertz, LIDAR/ RADAR, life science and medicine. Over the past 20 years extensive efforts have been dedicated to establish the analog of electronic IC platform technologies in the photonic domain. Today, PIC technologies are accessible at low cost in a variety of material systems on the German and European market. These technology platforms provide a large degree of convenience for potential PIC users, including process design kits, design automation tools, and multi-user logistics. Despite a much-reduced threshold in the area of PIC manufacturing, the question for users remains how to tackle a PIC based development, in particular with respect to packaging.

The ITG-Workshop will address this multi-faceted problem space by gathering experts of the entire spectrum of PIC manufacture and packaging providing their respective perspectives on the PIC application arena. Ample opportunity will be given to discuss possibilities as well as challenges for potential users of the PIC ecosystem.


Fee: 99,-€ (incl. VAT)

Organising Committee

Anna Lena Schall-Giesecke (Fraunhofer IMS)
Ulrich Fischer (Hochschule Harz)
Krzysztof Nieweglowski (TU Dresden)
Lars Zimmermann (TU Berlin)
Tolga Tekin (Fraunhofer IZM)


Fraunhofer IZM Berlin
Gustav-Meyer-Allee 25, 13355 Berlin
Geb. 17, Raum 17.060x

How to reach us in Berlin



9:30 – 10:00 Registration
10:00 – 11:20 Session 1: Platforms 
10:00 Michael Töpper, FMD
Research Fab Microelectronics Germany (FMD): Expanding to an European Advanced Heterogeneous System Integration Pilot Line
10:20 Axel Schönau, Fraunhofer HHI
Foundry and Packaging Services for InP Photonic Integrated Circuits
10:40 Georg Winzer, IHP
The photonic BiCMOS platform of IHP
11:00 Aleksandar Nesic, Fraunhofer IMS
Post-CMOS Photonics Platform
11:20 – 11:50 Coffee break
11:50 – 13:10 Session 2: Platforms and System Integration 
11:50 Joni Mellin, X-Fab
X-FAB “More than Photonics” – Enabling photonics innovation beyond PICs
12:10 Hermann Oppermann, Fraunhofer IZM
Photonics Hybrid Integration Challenge
12:30 Krzysztof Nieweglowski, TU Dresden
Multi-lithography process development for polymeric optics integration in electronic systems
12:50 Simon Kibben, Photonics Foundry
Photonics packaging automation: Turning ideas into concepts and products 
13:10 – 14:00 Lunch break
14:00 – 15:20 Session 3: Assembly and Packaging 
14:00 Gerrit Rössler, Berlin Partner für Wirtschaft und Technologie GmbH
Photonics and microelectronics in Berlin-Brandenburgs economic policy – support schemes and funding opportunities
14:20 Gianni Preve, Electron-mec
An investigation on automation for silicon photonics packaging
14:40 Andon Bano, ficonTEC
Technology Developments & Equipment Requirements for Scaling Up Photonics Production
15:00 Milan Milosevic, PHIX
Industrial Photonics Packaging – From Prototypes to Volume Production
15:20 – 15:50 Coffee break
15:50 – 17:10 Session 4: Use Cases 
15:50 Benjamin Wohlfeil, Adtran
Photonic Integrated Circuits for Optical Communication Networks
16:10 Torsten Grawunder, Swissbit AG
Could silicon photonics democratize the heterogeneous integration of chiplets?
16:30 Bogdan Sirbu, Fraunhofer IZM
Faster, higher, stronger: Co-packaged optics
16:50 Antonio Napoli, Infinera
Photonic Integrated Circuits for High-Speed Communications